A numerical study of the thermal performance of an impingement heat sink-fin shape optimization

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 4, 2004, Pages 710-717

  Shah, Amit ^a   Sammakia, Bahgat G ^b   Srihari, Hari ^b   Ramakrishna, Koneru ^c  

^a General Electric Company India   (India)

^b BINGHAMTON UNIVERSITY   (United States)

^c Digital DNA Laboratories   (United States)

Author keywords

Computational fluid dynamics; Electronics cooling; Flip chip plastic ball grid array packages (FC PBGA); Heatsink optimization; Heatsink with fan; Heatsinks; Impingement flow; Impingement heatsink; Thermal management

Indexed keywords

BOUNDARY CONDITIONS; COMPUTATIONAL FLUID DYNAMICS; FLIP CHIP DEVICES; HEAT SINKS; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; NUMERICAL ANALYSIS; OPTIMIZATION; SENSITIVITY ANALYSIS;

ELECTRONICS COOLING; FLIP CHIP BALL GRID ARRAY PACKAGES (FC-PBGA); HEAT SINK OPTIMIZATION; IMPINGMENT FLOW; IMPINGMENT HEAT SINK; THERMAL MANAGEMENT;

CHIP SCALE PACKAGES;

EID: 10344260833     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.838879     Document Type: Article

References (17)

1. C. Biber, "Choosing a heat sink-some tips and recommendations," EDN Access Mag., vol. 40, no. 21, pp. 125-128, Oct. 1995.
2. R. F. Kiley and C. A. Soule, "Engineered heat sinks," Powertech. Mag., July 1990.
3. C. A. Soule, "Air and liquid cooled techniques for high power density components," Power Conv. Intell. Motion, vol. 19, no. 11, 1993.
4. R. M. Dunn, M. Schulman, and N. Timko, "Electronic circuit module cooling," U.S. Patent 4 277 186, 1981.
5. R. G. Biskeborn, J. L. Horvath, and E. B. Hultmark, "Integral cap heat sink assembly for the IBM 4381 processor," in Proc. 4th Annu. Int. Electronic Packaging Soc. Conf., Baltimore, MD, 1984, pp. 468-474.
6. S. Oktay, B. Dessauer, and J. L. Horvath, "New internal and external cooling enhancements for the IBM 4381 module," in Proc. IEEE Int. Conf. Computer Design: VLSI in Computers (ICCD'83), Port Chester, NJ, 1983.
7. S. B. Sathe, K. M. Kelkar, K. C. Karki, C. C. Tai, C. R. Lamb, and S. V. Patankar, "Numerical prediction of flow and heat transfer in an impingement heat sink," in Proc. ASME Int. Electronics Packaging Conf. EEP, vol. 4-2, Binghamton, NY, 1993, pp. 893-898.
8. J. M. McPhee, T. S. O'Toole, and M. Yedvabny, "Cooling the VAX 9000," in Proc. Electro '90, Conf. Rec., Boston, MA, 1990, pp. 288-292.
9. J. S. Fitch, "A one dimensional thermal model for the VAX 9000 multichip units," in Proc. Thermal Modeling and Design of Electronic Systems and Devices, ASME Winter Annu. Meeting, vol. 153, Dallas, TX, 1990, pp. 59-64.
10. S. Heng and J. Pei, "Air impingement cooled pin-fin heat sink for multichip unit," in Proc. Nat. Electronic Packaging and Production Conf., vol. 2, Des Plaines, IL, 1991.
11. B. W. Bartilson, "Air impingement on a miniature pin-fin heat sink," in Proc. ASME Winter Annu. Meeting, Atlanta, GA, 1991.
12. C. Hilbert, S. Sommerfeldt, O. Gupta, and D. J. Herrell, "High performance air cooled heat sinks for integrated circuits," IEEE Trans. Compon., Hybrids Manufact. Technol., vol. 13, pp. 1022-1031. Dec. 1990.
13. S. B. Sathe and B. Sammakia, "An analytical study of the optimized performance of an impingement heat sink," in Proc. ASME/AIChE Nat. Heat Transfer Conf., vol. 1, Portland, OR, 1995, pp. 43-49.
14. K. Ramakrishna and T.-Y. T. Lee, "Prediction of thermal performance of flip-chip-plastic ball grid array (FC-PBGA) packages: Part 1: Effect of die size," in Proc. ASME Int. Mechanical Engineering Congress Expo. New York, NY, 2001, pp. 1-9.
15. FLOTHERM Instruction Manual. Surrey, U.K.: Flomerics, Ltd., 2001.
16. A. Shah, "Toward the optimization of air cooled heat sinks for microprocessors," M.S. thesis, State Univ. of New York at Binghamton, Binghamton, NY, 2002.
17. A. Shah, B. Sammakia, H. Srihari, and K. Ramakrishna, "Numerical optimization study for a parallel plate impingement heat sink," in Proc. IPACK'03 Int. Electronic Packaging Technical Conf. Exhibition, Maui, HI, July 6-11, 2003.