Backside failure analysis of GaAs MMIC ASICs

EPJ Applied Physics

Volumn 27, Issue 1-3, 2004, Pages 475-477

  Beaudoin, F ^a   Carisetti, D ^b   Clement, J C ^b   Desplats, R ^a   Perdu, P ^a  

^a CNES   (France)

^b THALES RESEARCH AND TECHNOLOGY   (France)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; FAILURE ANALYSIS; INFRARED RADIATION; LASER APPLICATIONS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; NONDESTRUCTIVE EXAMINATION; THERMOANALYSIS; TRANSPARENCY;

BACKSIDE FAILURE ANALYSIS; ELECTRICAL INTERPRETATION; OPTICAL DEFECTS; OPTICAL METHODS; THERMAL LASER SIMULATION;

SEMICONDUCTING GALLIUM ARSENIDE;

EID: 10244235428     PISSN: 12860042     EISSN: None     Source Type: Journal    
DOI: 10.1051/epjap:2004081     Document Type: Conference Paper

References (5)

1. K. Nikawa, S. Tozaki, Proceedings of the 19th International Symposium for Tasting and Failure Analysis, 1993, pp. 303-310
2. E. I. Cole Jr., P. Tangyunyong, D. L. Barton. 36th Annual International Reliability Physics Symposium, IEEE, 1998, pp. 129-136
3. F. Beaudoin, X. Chauffleur, J. P. Fradin, P. Perdu, R. Desplats, D. Lewis, Microelectr, Reliab. 41, 1477 (2001)
4. F. Beaudoin, R. Desplats, P. Perdu, D. Patrie, G. Haller, P. Poirier, P. Jacob, D. Lewis, Proceedings of the 27th International Symposium for Testing and Failure Analysis, 2001, pp. 227-235
5. A. Christou, in Reliability of Gallium Arsenide MMICs (J. Wiley and Sons, Chichester, 1992)