Adhesion strength of multi-layered diamond films on WC-Co alloy substrate

Thin Solid Films

Volumn 469-470, Issue SPEC. ISS., 2004, Pages 190-193

  Takeuchi, Sadao ^a   Kojima, Masaharu ^a   Takano, Sigeto ^b   Kanda, Kazutaka ^b   Murakawa, Masao ^a  

^a NIPPON INSTITUTE OF TECHNOLOGY   (Japan)

^b KANAZAWA UNIVERSITY   (Japan)

Author keywords

Adhesion strength; Diamond film; Multi layer; Wc Co alloy

Indexed keywords

ADHESION; BOND STRENGTH (CHEMICAL); CHEMICAL BONDS; ETCHING; FILM GROWTH; MULTILAYERS; NUCLEATION; SYNTHESIS (CHEMICAL); THERMAL EFFECTS; THERMOCOUPLES; THICKNESS MEASUREMENT; TUNGSTEN ALLOYS; X RAY DIFFRACTION ANALYSIS;

ADHESION STRENGTH; ELECTROETCHING; WC-CO ALLOYS;

DIAMOND FILMS;

EID: 10044230451     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.08.098     Document Type: Article

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