Magnetic-field-assisted assembly of metal/polymer/metal junction sensors

Applied Physics Letters

Volumn 84, Issue 1, 2004, Pages 133-135

  Zhang, Haiqian ^a   Boussaad, Salah ^a,b   Ly, Nguyen ^a   Tao, Nongjian J ^a  

^a Arizona State University ^*  (United States)

^b DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

POLYMER JUNCTIONS; THERMAL EVAPORATION;

AROMATIC POLYMERS; ATOMIC FORCE MICROSCOPY; CURRENT VOLTAGE CHARACTERISTICS; ELECTROLYTES; EVAPORATION; MAGNETIC FIELD EFFECTS; MICROELECTRODES; PHOTORESISTS; PROTEINS; SEMICONDUCTING POLYMERS; SEMICONDUCTING SILICON;

CHEMICAL SENSORS;

EID: 0942299981     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1633678     Document Type: Article

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