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Volumn 2, Issue , 2003, Pages 1152-1155
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A hysteresis-free platinum alloy flexure material for improved performance and reliability of MEMS devices
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Author keywords
Biological materials; Conducting materials; Hysteresis; Materials reliability; Microelectromechanical devices; Micromechanical devices; Platinum alloys; Springs; Thermal conductivity; Thermal resistance
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Indexed keywords
ACTUATORS;
BIOCOMPATIBILITY;
BIOLOGICAL MATERIALS;
CORROSION RESISTANCE;
DEPOSITION;
ELASTIC MODULI;
HEAT RESISTANCE;
HYSTERESIS;
MICROELECTROMECHANICAL DEVICES;
MICROSYSTEMS;
PLATINUM;
RUTHENIUM ALLOYS;
SOLID-STATE SENSORS;
SPRINGS (COMPONENTS);
THERMAL CONDUCTIVITY;
THERMAL CONDUCTIVITY OF SOLIDS;
TRANSDUCERS;
CONDUCTING MATERIALS;
CONTROL OF STRESS;
DEPOSITION PARAMETERS;
MATERIALS RELIABILITIES;
MECHANICAL PERFORMANCE;
MICROMECHANICAL DEVICE;
PERFORMANCE AND RELIABILITIES;
THIN FILM MATERIAL;
PLATINUM ALLOYS;
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EID: 0942292221
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/SENSOR.2003.1216975 Document Type: Conference Paper |
Times cited : (7)
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References (9)
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