Titanium nitride coatings on copper alloy prepared by dc reactive magnetron sputtering

Journal of Materials Processing Technology

Volumn 145, Issue 3, 2004, Pages 371-376

  Carrasco, C ^a   Segers, L ^b   Benavente, B ^a   Vergara, V ^a  

^a UNIVERSITY OF CONCEPCIÓN   (Chile)

^b UNIVERSITÉ LIBRE DE BRUXELLES   (Belgium)

Author keywords

Thin film characterization; Titanium nitride; Wear resistance

Indexed keywords

ADHESION; COPPER ALLOYS; CRACK PROPAGATION; ELASTICITY; ELECTRIC POTENTIAL; MAGNETRON SPUTTERING; MICROHARDNESS; SCANNING ELECTRON MICROSCOPY; SPUTTER DEPOSITION; THIN FILMS; TITANIUM NITRIDE; WEAR OF MATERIALS; WEAR RESISTANCE;

BIAS VOLTAGE; THIN FILM CHARACTERIZATION; WEAR PROTECTION;

PROTECTIVE COATINGS;

EID: 0942277631     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2003.09.001     Document Type: Article

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