Novel Self-Assembled Ultra-Low-k Porous Silica Films with High Mechanical Strength for 45 nm BEOL Technology

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 2003, Pages 139-142

  Oku, Y ^a   Yamada, K ^a   Goto, T ^a   Seino, Y ^b   Ishikawa, A ^a   Ogata, T ^a   Kohmura, K ^a   Fujii, N ^a   Hata, N ^b   Ichikawa, R ^b   Yoshino, T ^b   Negoro, C ^b   Nakano, A ^a   Sonoda, Y ^a   Takada, S ^b   Miyoshi, H ^a   Oike, S ^a   Tanaka, H ^a   Matsuo, H ^a   Kinoshita, K ^a   Kikkawa, T ^b,c   more..

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^c HIROSHIMA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACIDITY; COPOLYMERS; ELASTIC MODULI; PERMITTIVITY; POLYETHYLENES; PORE SIZE; POROUS SILICON; SELF ASSEMBLY; SILICA; SILICON WAFERS; SOL-GELS; SPIN COATING; SURFACE ACTIVE AGENTS;

INTERLINE SPACES; POROUS SILICA FILMS;

DIELECTRIC FILMS;

EID: 0842288290     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. H. Miyoshi, et al., "Theoretical analysis of ultra low-k porous films with periodic pore arrangement and high elastic modulus," Proceedings of the IITC2003, p57 (2003).
2. K. Yamada, Y. Oku, N. Hata, S. Takada, and T. Kikkawa, "Effects of surfactants on the properties of ordered periodic porous silica films," Jpn. J. Appl. Phys., 42, pl840 (2003).
3. Y. Oku, et al., "Effect of TEOS treatment on the properties of periodic nanoporous silica low-k film," Ext. Abst. 2002 Int. Conf. Solid State Devices and Materials, p42 (2002).
4. H. Matsuo, A. Ishikawa and T. Kikkawa, "In-situ Measurement of Friction Force during Cu Chemical Mechanical Polishing," Ext. Abst. 2003 Int. Conf. Solid State Devices and Material., p254 (2003).
5. Y. Seino, R. Ichikawa, H. Tanaka and T. Kikkawa, "Mechanical Property and Skeletal Silicate Structure of Periodic Porous Silica Films," Ext. Abst. 2003 Int. Conf. Solid State Devices and Material., p80 (2003).