Bend stiffness of copper and copper alloy foils

Journal of Materials Processing Technology

Volumn 146, Issue 2, 2004, Pages 228-233

  Tomioka, Yasuo ^a   Yuki, Norio ^a  

^a Innovative Materials Development Center   (Japan)

Author keywords

Bend stiffness; Copper alloy; Copper foil; Yield strength; Young's modulus

Indexed keywords

ANNEALING; COPPER ALLOYS; DEFLECTION YOKES; DENSITY (SPECIFIC GRAVITY); ELASTIC MODULI; HARDENING; PRECIPITATION (CHEMICAL); STIFFNESS; TENSILE TESTING; VIBRATIONS (MECHANICAL); YIELD STRESS;

BEND STIFFNESS; COPPER FOILS;

METAL FOIL;

EID: 0842265032     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2003.11.017     Document Type: Article

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