Effect of material processing on fatigue of FPC rolled copper foil

Journal of Electronic Materials

Volumn 29, Issue 5, 2000, Pages 611-616

  Hatano, Takaaki ^a   Kurosawa, Yoshio ^a   Miyake, Junji ^a  

^a Innovative Materials Development Center   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; FATIGUE OF MATERIALS; GRAIN SIZE AND SHAPE; METAL FOIL; STRAIN RATE;

LOW-CYCLE FATIGUE LIFE; ROLLED COPPER FOILS;

PRINTED CIRCUIT BOARDS;

EID: 0033735061     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-000-0054-z     Document Type: Article

References (8)

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3. Japanese Industrial Standards (JIS), C5016 (1999).
4. T.H. Courtney, Mechanical Behavior of Materials (NewYork: McGraw-Hill, 1990).
5. G.E. Dieter and D. Bacon, Mechanical Metallurgy (London: McGraw-Hill, 1988).
6. The Institute for Interconnecting and Packaging Electronics Circuits (IPC) Standards, TM-650 (1996).
7. A.A. Ridha and W.B. Hutchinson, Acta Metal. 30, 1929 (1982).
8. Y. Yamamoto, S. Sakai, O. Norio, and H. Ichige: Hitachi Cable Review 10, 91 (1991).