Electroplated lead-free tin alloys for electronics. Results from field tests

Transactions of the Institute of Metal Finishing

Volumn 80, Issue 3, 2002, Pages 97-100

  Jordan, Manfred ^a  

^a Max Schlötter   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANODES; CRACK INITIATION; DISSOLUTION; DUCTILITY; ELECTRODEPOSITION; GRAIN SIZE AND SHAPE; LEAD; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; SURFACE PHENOMENA; SURFACE ROUGHNESS; THERMAL EFFECTS; TIN ALLOYS; WETTING;

ANODIC REACTIONS;

ELECTROPLATING;

EID: 0036577278     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1080/00202967.2002.11871442     Document Type: Conference Paper

References (3)

1. Pure tin finish: A promising lead-free alternative
2. Lead-free packaging
3. Understanding the whisker phenomenon - Part II, competitive mechanisms