Monitoring wire bonding via time-frequency analysis of horn vibration

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 26, Issue 3, 2003, Pages 216-220

  Zhang, Dong ^a   Ling, Shih Fu ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Bond quality; Horn vibration; Neural network; Piezoelectric; Time frequency analysis; Wire bonding

Indexed keywords

ELECTRIC WIRE; FREQUENCY DOMAIN ANALYSIS; HIGH PASS FILTERS; INTERFACES (MATERIALS); NEURAL NETWORKS; PIEZOELECTRIC MATERIALS; SURFACES; TIME DOMAIN ANALYSIS; VIBRATIONS (MECHANICAL);

BOND QUALITY; HORN VIBRATION; LINEAR DYNAMIC SETTING; TIME FREQUENCY ANALYSIS; WIRE BONDING;

SOLDERING;

EID: 0742269019     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2003.820800     Document Type: Article

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