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Volumn 125, Issue 4, 2003, Pages 475-479

A vapotron effect application for electronic equipment cooling

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; ELECTRON DEVICES; FINS (HEAT EXCHANGE); FORCED CONVECTION; HEAT EXCHANGERS; HEAT TRANSFER COEFFICIENTS; TEMPERATURE; WATER;

EID: 0348197119     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1615796     Document Type: Article
Times cited : (27)

References (13)
  • 1
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    • (1998) , vol.4
    • Bar-Cohen, A.D.1    Kraus, A.2
  • 4
    • 0032210996 scopus 로고    scopus 로고
    • Convective flow and heat transfer in a channel containing multiple heated obstacles
    • Young, J. T., and Vafai, K., 1998, "Convective Flow and Heat Transfer in a Channel Containing Multiple Heated Obstacles," Int. J. Heat Mass Transfer, 41, pp. 3279-3298.
    • (1998) Int. J. Heat Mass Transfer , vol.41 , pp. 3279-3298
    • Young, J.T.1    Vafai, K.2
  • 5
    • 0040154759 scopus 로고    scopus 로고
    • Temperature distribution in advanced power electronics systems and the effect of phase change materials on temperature suppression during power pulses
    • Sept.
    • Evans, A. G., He, M. Y., Hutchinson, J. W., and Shaw, M., 2001, "Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses," ASME J. Electron. Packag., 123(3), Sept., pp. 211-217.
    • (2001) ASME J. Electron. Packag. , vol.123 , Issue.3 , pp. 211-217
    • Evans, A.G.1    He, M.Y.2    Hutchinson, J.W.3    Shaw, M.4
  • 6
    • 0039563659 scopus 로고    scopus 로고
    • Simplified analytical models for forced convection heat transfer from cuboids of arbitrary shape
    • Sept.
    • Culham, J. R., Yovanovich, M. M., Teertstra, P., Wang, C. S., Refai-Ahmed, G., and Min Tain, R., 2001, "Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape," ASME J. Electron. Packag., 123(3), Sept., pp. 182-188.
    • (2001) ASME J. Electron. Packag. , vol.123 , Issue.3 , pp. 182-188
    • Culham, J.R.1    Yovanovich, M.M.2    Teertstra, P.3    Wang, C.S.4    Refai-Ahmed, G.5    Min Tain, R.6
  • 7
    • 0038970581 scopus 로고    scopus 로고
    • A numerical model to predict the thermal and psychrometric response of electronic packages
    • Sept.
    • Vargas, J. V. C., Stanescu, G., and Florea, R., 2001, "A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages," ASME J. Electron. Packag., 123(3), Sept., pp. 200-210.
    • (2001) ASME J. Electron. Packag. , vol.123 , Issue.3 , pp. 200-210
    • Vargas, J.V.C.1    Stanescu, G.2    Florea, R.3
  • 8
    • 0038970642 scopus 로고    scopus 로고
    • Thermal performance of integrated plate heat pipe with a heat spreader
    • Sept.
    • Take, K., and Webb, R. L., 2001, "Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader," ASME J. Electron. Packag., 123(3), Sept., pp. 189-195.
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    • Take, K.1    Webb, R.L.2
  • 9
    • 85199264947 scopus 로고
    • Les processus de Vaporisation et le Vapotron
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    • (1961)
    • Beurtheret, C.A.1
  • 10
    • 0342284264 scopus 로고
    • Subcooled flow boiling CHF at high liquid velocity
    • Cumo, M., 1994, "Subcooled Flow Boiling CHF at High Liquid Velocity," ICHEME Symposium Series, No. 129, pp. 15-33.
    • (1994) ICHEME Symposium Series , Issue.129 , pp. 15-33
    • Cumo, M.1
  • 12
    • 0345986695 scopus 로고    scopus 로고
    • Experimental tests on subcooled boiling heat transfer under forced convection conditions
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  • 13
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