Photoacoustic imaging of voids in direct wafer bonding

Review of Scientific Instruments

Volumn 71, Issue 4, 2000, Pages 1869-1872

  Gracias, A C ^a   Kuranaga, C ^b   Senna, J R ^b  

^a INSTITUTO TECNOLÓGICO DE AERONÁUTICA   (Brazil)

^b INSTITUTO NACIONAL DE PESQUISAS ESPACIAIS   (Brazil)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0347741741     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1150553     Document Type: Article

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