Thermal stability of boron-containing phenol formaldehyde resin

Polymer Degradation and Stability

Volumn 63, Issue 1, 1999, Pages 19-22

  Gao, Jungang ^a   Liu, Yanfang ^a   Yang, Liting ^a  

^a HEBEI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BORON COMPOUNDS; CURING; FORMALDEHYDE; GLASS FIBER REINFORCED PLASTICS; INORGANIC ACIDS; LAMINATED COMPOSITES; OXIDATION RESISTANCE; PYROLYSIS; REACTION KINETICS; SYNTHESIS (CHEMICAL); THERMOANALYSIS; THERMODYNAMIC STABILITY;

BORIC ACID;

PHENOLIC RESINS;

EID: 0032740673     PISSN: 01413910     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0141-3910(98)00056-1     Document Type: Article

References (8)

1. Elias HG. Macromolecules, New York: Plenum Press, 1977:952-958.
2. Wu Y, Huang Z. Letter of polymer 1981;6:403.
3. Heefel HB, Kiessling HY, Lamper F, Schoenrogge B. Ger offen 1975;2:436,359.
4. Xu Q. Journal of Hebei University 1976;1:5.
5. Tu W, Wei S. Plastics Industry 1981;4:16.
6. Patts Jr WJ. Chemical infrared spectroscopy. New York: Wiley, 1963;I:191-200.
7. Liu Z. Introduction of thermal analysis. Beijing: Chemical Industry Publishing Co 1991:100-110.
8. Madhusudanan PM, Krishnan K, Ninan KN. Thermochem Acta 1986;97:189.