Sequential process modeling for determining process-induced thermal stress in advanced Cu/low-k interconnects

Materials Research Society Symposium - Proceedings

Volumn 766, Issue , 2003, Pages 39-44

  Yang, Kwanho ^a   Waeterloos, Joost J ^a   Im, Jang Hi ^a   Mills, Michael E ^a  

^a DOW CHEMICAL COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; COPPER; DELAMINATION; FINITE ELEMENT METHOD; THERMAL EXPANSION; THERMAL STRESS; THERMOMECHANICAL TREATMENT;

INDUCED THERMAL STRESS; SEQUENTIAL PROCESS MODELING; THERMOMECHANICAL PROPERTY;

DIELECTRIC MATERIALS;

EID: 0347569462     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-766-e6.2     Document Type: Conference Paper

References (4)

1. http://public.itrs.net
2. D. Gan, G. Wang, P.S. Ho, X. Morrow and J. Leu, Proc. Int. Interconnect Tech. Conf. 2002, pp. 271-273.
3. L. Mercado, C. Goldberg, S. Kuo, Proc. Int. Interconnect Tech. Conf. 2002, pp. 119-121.
4. V. Gonda, J.M.J. Den Toonder, J. Beijer, G.Q. Zhang, R.J.O.M. Hoofman, L.J. Ernst, Proc. Of EuroSIME 2003, pp. 359-363.