Ball bond characterization: An intensive analysis on ball size and shear test results and applicability to existing standards

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 46-51

  Aguila, Ma Magdalena T ^a   Felipe, Roseller C ^a   Velarde, Aleli F ^a   Edpan, Jonathan B ^a  

^a Allegro Microelectronics Phils   (Philippines)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONICS INDUSTRY; MECHANICAL TESTING; SHEAR STRENGTH; STANDARDS;

BALL BONDING; BALL SHEAR TEST;

ELECTRONICS PACKAGING;

EID: 0031313395     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)