Investigation of low-pressure plane plasma discharge

Plasma Devices and Operations

Volumn 10, Issue 4, 2002, Pages 251-261

  Golan, G ^a   Axelevitch, A ^a   Sigalov, B ^a   Gorenstein, B ^a  

^a OPEN UNIVERSITY OF ISRAEL   (Israel)

Author keywords

Langmuir probe; Plane plasma; Plasma; Sputtering; Triode sputtering

Indexed keywords

DISCHARGE (FLUID MECHANICS); ELECTRON BEAMS; SPUTTERING; VAPOR PRESSURE;

ION BEAM CONCENTRATION; PLASMA DISCHARGES; THIN FILM COATINGS;

PLASMA DEVICES;

EID: 0347406690     PISSN: 10519998     EISSN: None     Source Type: Journal    
DOI: 10.1080/1051999021000078350     Document Type: Article

References (15)

1. Hitohon, W. N. G. (1999). Plasma Processes for Semiconductor Fabrication. Cambridge University Press, NY.
2. Lieberman, M. A. and Lichtenberg, A. J. (1994). Principles of Plasma Discharges and Materials Processing. John Wiley & Sons, Inc, NY.
3. Mousel, T., Eckstein, W. and Gnaser, H. (1999). Energy spectra of sputtered species under sub-keV ion bombardment: Experiments and computer simulations. Nucl. Instr. and Meth. B, 152, 36-48.
4. Selitser, S. I. and Dobkin, D. M. Plasma damage. In: Fundamentals of Chemical Vapor Deposition (Educational information). http://www.timedomaincvd. com/CVD_Fundamentals/plasmas/plasma_damage.html
5. Alekseev, B. V. and Kotelnikov, W. A. (1988). Plasma Diagnosis by the Probe Method. Energoatomizdat, Moscow, (in Russian).
6. Huddlestone, R. H. and Leonard, S. L. (1965). Plasma Diagnostic Techniques. Academic Press, NY.
7. Mulally, F. (2000). Plasma Probe Investigation, http://www.netsoc.ucd.ie/ ~fergalm/plasma/plasma.html
8. Maissel, L. I. and Glang, R. (1970). Handbook of Thin Film Technology. McGraw-Hill, NY.
9. Course of Semiconductors, University of Kiel, Faculty of Engineering, http://www.techfek.uni-kiel.de/matwis/amat/semi_en/
10. Möller, A. (1998). Probe measurements of fluctuations and transport in reversed-field pinches. Dissertation thesis, Royal Institute of Technology, Stockholm.
11. Stokes, R. J. and Evans, D. F. (1997). Fundamentals of Interfacial Engineering. Wiley-VCH, NY.
12. Kossowsky, R. (1989). Surface Modification Engineering. CRC Press, Boca Raton.
13. Huba, J. D. (2000). Plasma Formulary, Naval Research Laboratory.
14. Selitser, S. I. and Dobkin, D. M. Ion flux to surfaces: The Bohm velocity. In: Fundamentals of Chemical Vapor Deposition (Educational information). http://www.timedomaincvd.com/CVD_Fundamentals/plasmas/ion_flux. html
15. Golan, G., Axelevitch, A., Margolin, R. and Rabinovitch, E. (2001). Novel approach to sputtered tantalum film resistors with controlled pre-defined resistance. Microelectronics Journal, 32, 60-67.