Nonrectangular Shaping and Sizing of Soft Modules for Floorplan-Design Improvement

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Volumn 23, Issue 1, 2004, Pages 71-79

  Chu, Chris C N ^a   Young, Evangeline F Y ^b  

^a Iowa State University   (United States)

^b CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Floorplanning; Lagrangian relaxation; Physical design; Rectilinear modules; Shaping; Sizing

Indexed keywords

ASPECT RATIO; COMPUTATIONAL COMPLEXITY; INTEGRATED CIRCUITS; MATHEMATICAL PROGRAMMING; NONLINEAR EQUATIONS; OPTIMIZATION; PROBLEM SOLVING;

FLOORPLANNING; LAGRANGIAN RELAXATION; PHYSICAL DESIGN (PD); RECTILINEAR MODULES;

PRODUCT DESIGN;

EID: 0347131048     PISSN: 02780070     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAD.2003.819896     Document Type: Article

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