Effects of package orientation and mixed convection on heat transfer from a PQFP

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 2, 1997, Pages 152-159

  Sikka, Kamal K ^a   Fisher, Timothy S ^a   Torrance, Kenneth E ^a   Lamb, Charles R ^b  

^a Cornell University   (United States)

^b Scientific Testing   (United States)

Author keywords

JEDEC; Mixed convection; Orientation; PQFP

Indexed keywords

BOUNDARY LAYERS; ELECTRONICS PACKAGING; HEAT CONVECTION; HEAT RESISTANCE; STANDARDIZATION; WIND TUNNELS;

PACKAGE ORIENTATION; PLASTIC QUAD FLAT PACKAGE (PQFP);

SURFACE MOUNT TECHNOLOGY;

EID: 0031169044     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.588567     Document Type: Article

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