Convective heat transfer from a rotating ceramic-based multichip disk with round jet impingement

Proceedings of the National Heat Transfer Conference

Volumn 1, Issue , 2001, Pages 97-103

  Hung, Y H ^a   Shieh, Y R ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANEMOMETERS; BUOYANCY; COOLING; DATA REDUCTION; JETS; NUSSELT NUMBER; REYNOLDS NUMBER; ROTATING DISKS; TEMPERATURE DISTRIBUTION; THERMOCOUPLES; THERMOGRAPHY (IMAGING); VELOCITY MEASUREMENT;

JET IMPINGEMENT COOLING; MASS FLOW CONTROLLERS;

HEAT CONVECTION;

EID: 0346955722     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Bergles A. E., 1986, "Evolution of Cooling Technology for Electrical, Electronic, and Microelectronic Equipment," ASME Heat Transfer in Electronic Equipment, 57, pp.1-9.
2. Kline, S. J., and McClintock, F. A., 1953, "Describing Uncertainties in Single-Sample Experiments," Mech. Engng, pp.3-8.
3. Moffat, R. J., 1988, "Describing the Uncertainties in Experimental Results," Expl. Thermal Fluid Sci., 1, pp.3-17.
4. Churchill, S. W, and Usag, R., 1972, "A General Expression for the Correlation of Rates of Transfer and Other Phenomena," AlChE Journal, 18, pp.1121-1128.
5. Shieh, Y. R., 1998, "Heat Transfer from a Horizontal Ceramic-Based Disk of Multi-Chip Modules," Ph.D. Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan.
6. Shieh, Y. R., Li, C. J., and Hung, Y. H., 1999, "Heat Transfer from a Horizontal Wafer-Based Disk of Multi-Chip Modules," International Journal of Heat and Mass Transfer, 42, pp. 1007-1022.