Heat transfer from a horizontal wafer-based disk of multichip modules

International Journal of Heat and Mass Transfer

Volumn 42, Issue 6, 1999, Pages 1007-1022

  Li, C J ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CONVECTION; COOLING; ELECTRONIC EQUIPMENT; HEAT TRANSFER;

EID: 0344759093     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0017-9310(98)00182-3     Document Type: Article

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