Chip-Package Resonance in Core Power Supply Structures for a High Power Microprocessor

Advances in Electronic Packaging

Volumn 1, Issue , 2001, Pages 63-68

  Smith, Larry D ^a   Anderson, Raymond E ^a   Roy, Tanmoy ^a  

^a SUN MICROSYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SILICON CIRCUITS; VOLTAGE REGULATOR MODULES (VRM);

CAPACITANCE; CAPACITORS; COMPUTER SIMULATION; ELECTRIC CURRENTS; ELECTRIC IMPEDANCE; ELECTRIC INDUCTORS; ELECTRIC POTENTIAL; ELECTRIC POWER SYSTEMS; ELECTRONICS PACKAGING; EQUIVALENT CIRCUITS; INDUCTANCE; MICROPROCESSOR CHIPS; NATURAL FREQUENCIES; RESISTORS; RESONANCE;

CHIP SCALE PACKAGES;

EID: 0346938648     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. L.D.Smith, R.E.Anderson, D.W.Forehand, T.J.Pelc, T.Roy, "Power Distribution System Design Methodology and Capacitor Selection for Modern CMOS Technology," IEEE Transactions on Advanced Packaging, Vol.22, No.3, P284, August 1999.
2. M.A.Ang, R.B.Salem, A.D.Taylor, "An On-chip Voltage Regulator using Switched Decoupling Capacitors," ISSCC Proceedings pp. 438-439, Feb 2000.
3. I. Novak, "Measuring Milliohms and PicoHenrys in Power Distribution Networks," http://home.att.net/̃istvan.novak/papers.html, Design Con 2000.
4. L.D.Smith, R.E.Anderson, T.Roy, "Power Plane SPICE Models and Simulated Results in the Frequency and Time Domains," to be published in IEEE Transactions on Advanced Packaging.