New reflow process for indium bump

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3061, Issue , 1997, Pages 60-67

  Kim, Young Ho ^a   Choi, Jong Hwa ^a   Choi, Kang Sik ^a   Lee, Hee Chul ^a   Kim, Choong Ki ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL REACTIONS; FLIP CHIP DEVICES; INFRARED RADIATION; MERCURY COMPOUNDS; PLASMAS; SHEAR STRAIN; SHEAR STRENGTH;

CHIP BONDINGS; INDIUM BUMPS; REFLOW PROCESSES; SMOOTH SURFACES;

INDIUM;

EID: 0346862768     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.280315     Document Type: Conference Paper

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