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Volumn 3135, Issue , 1997, Pages 96-105

Refractive microlens arrays made by contactless embossing

Author keywords

Alignment; Compression molding; Embossing; LIGA; Micro optical bench; Micro optics; Microlens arrays; MOEMS; Plastic optics; Refractive microlens

Indexed keywords

ALIGNMENT; COMPRESSION MOLDING; COST EFFECTIVENESS; DIES; HYBRID SYSTEMS; LENSES; MICROFABRICATION; MICROOPTICS; MOLDING; OPTICAL INSTRUMENT LENSES; OPTICAL INSTRUMENTS; THICKNESS MEASUREMENT;

EID: 0346751871     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284097     Document Type: Conference Paper
Times cited : (4)

References (14)
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  • 8
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    • Preshaping photoresist for refractive microlens fabrication
    • Nov
    • T. R. Jay, M. B. Stern, "Preshaping photoresist for refractive microlens fabrication", Opt. Eng., Vol. 33, No. 11, 3552-3355, (Nov. 1994).
    • (1994) Opt. Eng , vol.33 , Issue.11 , pp. 3552-3355
    • Jay, T.R.1    Stern, M.B.2
  • 9
    • 0141783230 scopus 로고    scopus 로고
    • Technique for monolithic fabrication of silicon microlenses with selectable rim angles
    • April
    • L. Erdmann, D. Efferen, "Technique for monolithic fabrication of silicon microlenses with selectable rim angles", Opt. Eng. 36 (4) pp. 1094-1098 (April 1997).
    • (1997) Opt. Eng , vol.36 , Issue.4 , pp. 1094-1098
    • Erdmann, L.1    Efferen, D.2
  • 10
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    • R. E. Parks, Overview of optical manufacturing methods, SPIE 306 Contemporary Methods of Optical Fabrication, pp. 2-12 (1981).
    • R. E. Parks, "Overview of optical manufacturing methods", SPIE Vol. 306 Contemporary Methods of Optical Fabrication, pp. 2-12 (1981).
  • 11
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    • Deep X-Ray Lithography for the Production of Threedimensional Microstructures from Metals, Polymers and Ceramics
    • W. Ehrfeld, and H. Lehr; "Deep X-Ray Lithography for the Production of Threedimensional Microstructures from Metals, Polymers and Ceramics", Radiat. Phys. and Chem., Vol. 45, No. 3, pp. 349-365, (1995).
    • (1995) Radiat. Phys. and Chem , vol.45 , Issue.3 , pp. 349-365
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  • 13
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    • L. Weber, H.-D. Bauer, F. Michel, A. Picard, W. Ehrfeld, LIGA Technique for packaging and interconnection, Proceedings of the EUPAC'94, 1st European Conference on Electronic Packaging Technology & 7th Int. Conference Interconnection Technology in Electronics, Essen, 01.- 03. Feb 1994, S 104-106, DVS Verlag GmbH, Düsseldorf, Germany (1994).
    • L. Weber, H.-D. Bauer, F. Michel, A. Picard, W. Ehrfeld, "LIGA Technique for packaging and interconnection", Proceedings of the EUPAC'94, 1st European Conference on Electronic Packaging Technology & 7th Int. Conference "Interconnection Technology in Electronics", Essen, 01.- 03. Feb 1994, S 104-106, DVS Verlag GmbH, Düsseldorf, Germany (1994).


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.