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Volumn 31, Issue 4, 2002, Pages 232-237

DeleCut: Producing High-Quality SOI Structures by Hydrogen Ion Implantation

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0346388415     PISSN: 10637397     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1016335113235     Document Type: Article
Times cited : (2)

References (9)
  • 4
    • 0007303854 scopus 로고    scopus 로고
    • New York: Wiley-Interscience
    • Tong, Q.-Y. and Goesele, U., Wafer Bonding, New York: Wiley-Interscience, 1999, p. 52.
    • (1999) Wafer Bonding , pp. 52
    • Tong, Q.-Y.1    Goesele, U.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.