Delayed fracture behavior of ceramics under tensile loading at elevated temperatures

Journal of the Ceramic Society of Japan

Volumn 111, Issue 1299, 2003, Pages 793-799

  Ohji, Tatsuki ^a  

^a NIAIST   (Japan)

Author keywords

Alumina; Ceramics; Creep; Delayed fracture; High temperature; Nanocomposite; Silicon carbide; Silicon nitride; Tension

Indexed keywords

ALUMINA; CREEP; DIFFUSION IN SOLIDS; FRACTURE; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; HIGH TEMPERATURE OPERATIONS; INTERFACES (MATERIALS); NUCLEATION; SILICON CARBIDE; SILICON NITRIDE; TENSILE TESTING;

ALUMINA SILICON CARBIDE NANOCOMPOSITES; DELAYED FRACTURE MECHANISM; MONKMAN GRANT RELATION; PINNING EFFECT; STRESS OF CREEP;

CERAMIC MATRIX COMPOSITES;

EID: 0346361730     PISSN: 09145400     EISSN: None     Source Type: Journal    
DOI: 10.2109/jcersj.111.793     Document Type: Article

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