Particle/matrix interface and its role in creep inhibition in alumina/silicon carbide nanocomposites

Journal of the American Ceramic Society

Volumn 79, Issue 1, 1996, Pages 33-45

  Ohji, Tatsuki ^a,c   Hirano, Takeshi ^b,c   Nakahira, Atsushi ^b,c   Niihara, Koichi ^b,c  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b OSAKA UNIVERSITY   (Japan)

^c AMERICAN CERAMIC SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BOND STRENGTH (MATERIALS); CREEP; FRACTURE TOUGHNESS; GRAIN BOUNDARIES; INTERFACES (MATERIALS); NANOSTRUCTURED MATERIALS; PARTICLES (PARTICULATE MATTER); RESIDUAL STRESSES; SILICON CARBIDE; THERMAL STRESS; TRANSMISSION ELECTRON MICROSCOPY;

CREEP INHIBITION; INTERFACIAL BONDING;

CERAMIC MATRIX COMPOSITES;

EID: 0029755314     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.1996.tb07877.x     Document Type: Article

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