Improved static and transient thermal management of handsets using heat spreaders and Phase Change Materials (PCMS)

Proceedings of the National Heat Transfer Conference

Volumn 1, Issue , 2001, Pages 205-214

  Weinstein, Randy D ^a   Hodes, Marc ^b   Piccini, Jason M ^a  

^a Villanova University   (United States)

^b LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT SPREADERS; PHASE CHANGE MATERIAL (PCM);

ABS RESINS; CONSUMER ELECTRONICS; ERGONOMICS; HEAT LOSSES; HEAT STORAGE; INFRARED IMAGING; POWER AMPLIFIERS; SPECIFIC HEAT; THERMAL CONDUCTIVITY;

HEAT TRANSFER;

EID: 0346325788     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Alawadhi, E.M. and Amon, C.H., 2000, "PCM Thermal Storage Unit for Time-Dependent Thermal Management of Electronic Devices," Proceedings of NHTC2000, Paper #12195, Pittsburgh, PA, ASME International.
2. Hodes, M., Weinstein, R.D., Pence, S.J., Talieri, J.A. Manzione, L., Chen, C., 2000, "Transient Thermal Management of Handsets Using Phase Change Materials (PCMs)," Proceedings of NHTC2000, Paper #12196, Pittsburgh, PA, ASME.
3. Hodes, M., Weinstein, R.D., Pence, S.J., Piccini, J.M., Manzione, L., Chen, C., 2000B, "Heat Transfer Analyses of a Handset Using Phase Change Material (PCM) for Transient Thermal Management," submitted to J. Elec. Packag.
4. Leoni, N. and Amon, C.H., 1997 "Transient Thermal Design of Wearable Computers with Embedded Electronics Using Phase Change Materials, " HTD-Vol. 343, National Heat Transfer Conference, ASME, Vol. 5, pp.49-56.
5. Minichiello, A., Hartley, J., Glezer, A., and Black, W, 1997 "Thermal Management of Sealed Electronic Enclosures Using Synthetic Jet Technology," Interpack '97, EEP-Vol. 19-2, Advances in Electronic Packaging, ASME, Vol. 2, pp. 1809-1812.
6. Pence, S., "Thermal Management of Portable Electronic Devices Using Phase Change Materials," Bachelor of Chemical Engineering Thesis, Villanova University, 2000.
7. Ramakrishna, K., Lee, T.Y., Hause, J.V., Chambers, B.C., and Mahalingam, M., 1996 "Experimental Evaluation of Thermal Performance of and Cooling Enhancements to a Handheld Portable Electronic System," Process, Enhanced, and Multiphase Heat Transfer: A Festschrift for A.E. Bergles, Begell House, Inc., pp. 217-226.
8. Vesligaj, M., Amon, C.H, 1999, "Transient Thermal Management of Temperature Fluctuations during Time Varying Workloads on Portable Electronics," IEEE Transactions Comps. Manuf. Technology, Vol. 22, Number 4, pp. 1415-1424.