Evaluation of a Printable Catalyst for Use in Flex-Circuit & PCB Applications

Plating and Surface Finishing

Volumn 88, Issue 7, 2001, Pages 60-66

  Kuruganti, Aruna S ^a   Chen, Ken S ^d   Kalu, Egwu E ^b,c  

^a OSMANIA UNIVERSITY   (India)

^b FAMU FSU COLLEGE OF ENGINEERING   (United States)

^c UNIVERSITY OF BRITISH COLUMBIA   (Canada)

^d NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0346311260     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (14)

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2. P. Bindra & J.R. White, in Electroless Plating Fundamentals, G.O. Mallory & J.B. Hajdu, Eds., American Electroplaters & Surface Finishers Society, Orlando, FL, 1993; p. 321.
3. R.J. Zeblisky, U.S. Patent 3,672,938 (1972).
4. H.H. Law, C.A. Mattoe, J. Thomson. Jr., T.E. Smith & R. Zappulla, Plating & Surface Finishing, 81, 71 (November 1993).
5. Handbook of Flexible Circuits, K. Gileo, Ed., Van Nostrand Reinhold, New York, NY, 1991; p. 141.
6. A.S. Kuruganti, K.S. Chen & E.E. Kalu, Electrochemical & Solid-State Letters, 2, 27 (January 1999).
7. E.E. Kalu, Plating & Surface Finishing, 85, 74 (March 1998).
8. E.F. Tokas, R.M. Shatout & K.S. Chen, U.S. Patent 5,348,574.
9. T.H. Sterns, Flexible Printed Circuitry, McGraw Hill, New York, NY, 1996.
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12. T. Homma, M. Tanabe, K. Itakura, & T. Osaka, J. Electrochem. Soc., 144, (1997).
13. M. Matsuoko, J. Murai, & C. Iwakara, J.Electrochem. Soc.. 139, (1992).
14. J. Shu, B.P.A. Grandjean, E. Ghali, & S. Kaliaguine, J. Electrochem. Soc., 141, (1993).