Elimination of Whisker Growth on Tin Plated Electrodes

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 1997-October, Issue , 1997, Pages 305-311

  Endo, M ^a   Higuchi, S ^a   Tokuda, Y ^a   Sakabe, Y ^a  

^a MURATA MANUFACTURING CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BRASS; CRYSTAL WHISKERS; FILM GROWTH; II-VI SEMICONDUCTORS; METALLIC FILMS; THICK FILMS; TIN; ZINC OXIDE;

BASE METALS; BRASS SUBSTRATES; CHIP CAPACITOR; CONDITION; GROWTH PHENOMENA; METALS MATERIALS; MONOLITHIC CHIP; TIN LAYERS; TIN WHISKER; WHISKER GROWTH;

NICKEL;

EID: 84876495145     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31399/asm.cp.istfa1997p0305     Document Type: Conference Paper

References (6)

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2. W.C.Ellis, D.F.Gibbons and RG.Treuting, Growth and Perfection of Crystals, p102, ed RH.Doremus, B.W.Roberts and D.Turnbull, N.Y. John Wiley(1958).
3. RM.Fisher, L.S.Darken and KG.Carroll, Acta Metallurgica, 2, 368-373(1954).
4. A.Jafre, Plating, 358(1973).
5. RKawanaka, KFujiwara, S.Nango and T.Hasegawa, J.J. Appl. Phys., 22, 917-922 (1983).
6. KN.Tu, Acta Metallurgica, 21, 347-354(1973).