Design of miniature loop heat pipe

Heat Transfer - Asian Research

Volumn 33, Issue 1, 2004, Pages 42-52

  Chu, C I ^a   Wu, S C ^b   Chen, P L ^a   Chen, Y M ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b NATIONAL DEFENSE UNIVERSITY   (Taiwan)

Author keywords

Electronic cooling; Loop heat pipe; Wick structure

Indexed keywords

COOLING; EVAPORATORS; HEAT RESISTANCE; HEAT TRANSFER;

ELECTRONIC COOLING; WICK STRUCTURE;

HEAT PIPES;

CONDENSER; COOLING; DESIGN; EVAPORATOR; HEAT PIPE; HEAT TRANSFER; MATHEMATICAL ANALYSIS;

EID: 0346008045     PISSN: 10992871     EISSN: None     Source Type: Journal    
DOI: 10.1002/htj.10133     Document Type: Article

References (7)

1. Maidanik YF, Vershinin S, Kholodov V, Dolgirev J. Heat transfer apparatus. US Patent No. 4515209, May 7, 1985.
2. Baldassarre JG, Gernert NJ, Gottschlich J. Loop heat pipe for avionics thermal control. SAE Paper No. 961318, 1996.
3. Maidanik YF, Vershinin SV, Chernysheva MA. Development and tests of miniature loop heat pipe with a flat evaporator. SAE Paper No. 2000-01-2491, 2000;652-656.
4. Chen PC, Lin WK. The application of capillary pumped loop for cooling of electronic components. Appl Therm Eng 2001;21:1739-1754.
5. Chu CY. Design, fabrication and performance testing of miniature loop heat pipe. Master's thesis, National Taiwan University, 2001.
6. Chi SW. Heat pipe theory and practice. McGraw-Hill; 1976.
7. Tracey VA. Pressing and sintering of nickel powders. Int J Powder Metall Powder Tech 1984;20:281-285.