Rate-controlling mechanism during plastic deformation of 95.5Sn4CuO.5Ag solder joints at high homologous temperatures

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1551-1557

  Conrad, H ^a   Guo, Z ^a   Pao, Yi Hsin ^b  

^a North Carolina State University   (United States)

^b FORD RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0342744942     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (24)

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