Heat transfer measurement and analysis for sintered porous channels

Journal of Heat Transfer

Volumn 116, Issue 2, 1994, Pages 456-464

  Hwang, G J ^a   Chao, C H ^a,b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Electronic equipment; Forced convection; Porous media

Indexed keywords

CHANNELS; HEAT TRANSFER; POROUS MEDIA; SINTERED MATERIALS;

SINTERED POROUS CHANNELS; TRANSVERSE THERMAL DISPERSION;

COMPUTERS; COOLING; FLOW OF FLUIDS; HEAT TRANSFER; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; POROUS MATERIALS; SINTERING;

ELECTRONICS PACKAGING;

EID: 0028427445     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.2911418     Document Type: Article

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