Enhanced adhesion and thermal stability of Al/Cr film on indium-tin-oxide (ITO)-coated glass

Journal of Adhesion Science and Technology

Volumn 17, Issue 15, 2003, Pages 2085-2095

  Hsieh, J H ^a   Wu, Tzong Ming ^b   Tong, J Z ^b   Yang, Y S ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^c METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE   (Taiwan)

Author keywords

Adhesion; Al Cr film; ITO; LCD; Metallization; Wire bonding

Indexed keywords

ALUMINUM; CHROMIUM; DOPING (ADDITIVES); GLASS; INDIUM COMPOUNDS; INTERFACES (MATERIALS); OXYGEN; THERMODYNAMIC STABILITY; THIN FILMS; ADHESION; BOND STRENGTH (MATERIALS); ELECTRONICS PACKAGING; FLOW RATE; GLASS PLANTS; INDIUM; ITO GLASS; LIQUID CRYSTAL DISPLAYS; METALLIC FILMS; METALLIZING; SEMICONDUCTOR DOPING; TIN;

ADHESION STRENGTH; INDIUM TIN OXIDE; WIRE BONDING;

ADHESION; INTERFACES (MATERIALS);

AL FILMS; CHEMICAL INERTNESS; COATED GLASS; COMPOSITE THIN FILMS; CR FILM; INDIUM TIN OXIDE; INTERFACE CONDITIONS; INTERFACE OXIDE; ITO; MAXIMUM VALUES; METALLIZATIONS; OXIDE LAYER; OXIDE THICKNESS; POOR ADHESION; WIRE BONDING; WIRE BONDS; WIRE PULL STRENGTH;

EID: 0345765382     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856103322584227     Document Type: Article

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