Via resistance reduction using "cool" PVD-Ta processing

Journal of the Electrochemical Society

Volumn 150, Issue 12, 2003, Pages

  Seet, C S ^a   Zhang, B C ^a   Yong, Clare ^b   Liew, S L ^a   Li, K ^a   Hsia, L C ^a   Seng, H L ^b   Osiposwicz, T ^b   Sudijono, J ^a   Zeng, Hua Chun ^b   Tan, J B ^a  

^a CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BACKSCATTERING; COPPER; ELECTRON DIFFRACTION; PHYSICAL VAPOR DEPOSITION; SPECTROSCOPIC ANALYSIS; TANTALUM; THERMAL EFFECTS; X RAY DIFFRACTION ANALYSIS;

COOL TANTALUM PROCESSING; RUTHERFORD BACKSCATTERING;

ELECTROCHEMISTRY;

EID: 0345759687     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1621417     Document Type: Article

References (8)

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