Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces

Journal of Electronic Packaging

Volumn 124, Issue 4, 2002, Pages 328-333

  Ritter, John E ^a   Jacome, G S ^a   Pelch, J R ^a   Russell, T P ^a   Lardner, T J ^a  

^a UNIVERSITY OF MASSACHUSETTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0345752884     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1503064     Document Type: Article

References (9)

1. Plueddemann, E. P., 1991. Silane Coupling Agents, 2nd Edition, Plenum Press, New York, NY.
2. Ritter, J. E., Fox, J. R., Hutko, D. I., and Lardner, T. J., 1998, "Moisture-Assisted Crack Growth at Epoxy-Glass Interfaces," J. Mater. Sci., 33, 4581-4588.
3. Ritter, J. E., and Huseinovic, A., 2001, "Adhesion and Reliability of Epoxy/ Glass Interfaces," ASME J. Electron. Packag., 123, pp. 401-404.
4. Ritter, J. E., Learned, J. C., Jáconie, G. S., Russell, T. P., and Lardner, T. J., 2001, "Fatigue and Durability of Silane Bonded Epoxy/Glass Interfaces," J. Adhesion, 76, pp. 335-352.
5. Turner, M. R., Dalgleish, B. J., Yitte, M., and Evans, A. G., 1995, "A Fracture Resistance Measurement Method for Bimaterial Interfaces Having Large Debond Energy,"" Acta Metall. Mater., 43. pp. 3459-3465.
6. He, M. Y., Turner, M. R., and Evans, A. G., 1995, "Analysis of the Double Cleavage Drilled Compression Specimen for Interface Fracture Energy Measurements Over a Range of Mode Mixities," Acta Metall. Mater., 43, pp. 3453-3458.
7. Suo, Z., and Hutchinson, J. W., 1989, "Sandwich Test Specimens for Measuring Interface Crack Toughness," Mater. Sci. Eng., A107, pp. 135-143.
8. Hertzberg, R. W., 1983, Deformation and Fracture Mechanics of Engineering Materials, 4th Edition, John Wiley and Sons.
9. Bagchi, A., and Evans, A. G., 1996, "The Mechanics and Physics of Thin Film Decohesion and Its Measurements," Interface Sci., 3, pp. 169-193.