An effective end point detector on oxide CMP by motor current

10th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, ASMC 1999

Volumn , Issue , 1999, Pages 295-298

  Lin, Bih Tiao ^a   Lee, S N ^a  

^a WSMC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; DIELECTRIC FILMS; MANUFACTURE; POINT CONTACTS; SEMICONDUCTOR DEVICE MANUFACTURE;

CHEMICAL MECHANICAL POLISHING(CMP); CMP PROCESS; END POINTS; END-POINT DETECTORS; IN-SITU MEASUREMENT; MOTOR CURRENTS; OXIDE-CMP; PATTERN WAFERS;

CHEMICAL MECHANICAL POLISHING;

EID: 0345573801     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASMC.1999.798248     Document Type: Conference Paper

References (3)

1. S. Kishii, K. Nakamura, and Y. Arimoto, 1997 Symposium on VLSI Technology Digest of Technical Papers, pp. 27-28.
2. Dr. Willian Yueh, 1997 SEMI Technology Programs Present. pp. 3 19-322.
3. EBARA Co. , Private discussion.