Thermal stability of metal nanoclusters formed by low-pressure plasma sputtering

Thin Solid Films

Volumn 428, Issue 1-2, 2003, Pages 242-247

  Thomann, A L ^a   Salvetat, J P ^b   Breton, Y ^b   Andreazza Vignolle, C ^b   Brault, P ^a  

^a UNIVERSITÉ D'ORLÉANS   (France)

^b CNRS   (France)

Author keywords

Carbon nanotube; Catalytic growth; Coalescence; Metal cluster; Plasma sputtering

Indexed keywords

CARBON NANOTUBES; CATALYSIS; CHARACTERIZATION; COALESCENCE; GROWTH (MATERIALS); HEAT TREATMENT; MORPHOLOGY; PALLADIUM; PRESSURE EFFECTS; SILICON; SPUTTERING; SUBSTRATES; THERMODYNAMIC STABILITY;

LOW-PRESSURE PLASMA SPUTTERING;

NANOSTRUCTURED MATERIALS;

EID: 0344951029     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(02)01279-8     Document Type: Conference Paper

References (21)

1. Treacy M.M.J., Ebbesen T.W., Gibson J.M. Nature (Lond.). 381:1996;678.
2. Niu C., Sichel E.K., Hoch R., Moy D., Tennent H. Appl. Phys. Lett. 70:1997;1480.
3. Fan S., Chapline M.G., Franklin N.R., Tombler T.W., Cassell A.M., Dai H. Science. 283:1999;512.
4. Lee C.J., Kim D.W., Lee T.J., Choi Y.C., Park Y.S., Lee Y.H., Choi W.B., Lee N.S., Park G.-S., Kim J.M. Chem. Phys. Lett. 312:1999;461.
5. Ren Z.F., Huang Z.P., Xu J.W., Wang J.H., Bush P., Siegal M.P., Provencio P.N. Science. 282:1998;1105.
6. Brault P., Thomann A.L., Andreazza-Vignolle C. Surf. Sci. 406:1998;L597.
7. Thomann A.L., Rozenbaum J.P., Brault P., Andreazza-Vignolle C., Andreazza P. Appl. Surf. Sci. 158:2000;172.
8. Berthet A., Thomann A.L., Cadete Santos Aires F.J., Brun M., Deranlot C., Bertolini J.C., Rozenbaum J.P., Brault P., Andreazza P. J. Catal. 190:2000;49.
9. Brault P., Thomann A.L., Rozenbaum J.P., Andreazza C., Andreazza P., Rousseau B., Estrade-Szwarckopf H., Blondiaux G., Sauvage T., Tessier Y., Berthet A., Bertolini J.C., Cadete Santos Aires F.J., Monnet F., Mirodatos C., Charles C., Boswell R. Recent Res. Dev. Vac. Sci. Technol. 2:2000;35.
10. Venables J.A., Spiller G.D.T., Hanbücken M. Rep. Prog. Phys. 47:1984;399.
11. Thomann A.L., Charles C., Brault P., Laure C., Boswell R. Plasma Sources Sci. Technol. 7:1998;245.
12. Tsai S.H., Chao C.W., Lee C.L., Shih H.C. Appl. Phys. Lett. 74:(23):1999;3462.
13. Kepinski L. Catal. Today. 50:1999;237.
14. Terrones H., Hayashi T., Munoz-Navia M., Terrones M., Kim Y.A., Grobert N., Kamalakaran R., Dorantes-Davila J., Escudero R., Dresselhaus M.S., Endo M. Chem. Phys. Lett. 343:2001;241.
15. Mitchell C.E.J., Howard A., Carney M., Egdell R.G. Surf. Sci. 490:2001;196.
16. Peng D.L., Konno T.J., Wakoh K., Hihara T., Sumiyama K. Eur. Phys. J. D16:2001;329.
17. Cleveland C.L., Luedtke W.D., Landman U. Phys. Rev. B. 60:(7):1999;5065.
18. Choi Y.C., Bae D.J., Lee Y.H., Lee B.S., Han I.T., Choi W.B., Lee N.S., Kim J.M. Synth. Mater. 108:2000;159.
19. Noupa C., Rousset J.L., Tardy B., Bertolini J.C. Catal. Lett. 22:1993;197.
20. Baker R.T.K. Carbon. 27:1989;315.
21. Lee C.J., Park J. J. Phys. Chem. B. 105:2001;2365.