-
1
-
-
0027607671
-
The potential for advanced ceramics in automotive engine applications
-
Mangin, C., Neely, J., and Clark, J. 1993. The potential for advanced ceramics in automotive engine applications. Journal of Metals (6): 23-27.
-
(1993)
Journal of Metals
, Issue.6
, pp. 23-27
-
-
Mangin, C.1
Neely, J.2
Clark, J.3
-
3
-
-
0041377264
-
Brazing ceramics and metals
-
Okamura, H. 1993. Brazing ceramics and metals. Welding Inter. 7(3): 236-242.
-
(1993)
Welding Inter.
, vol.7
, Issue.3
, pp. 236-242
-
-
Okamura, H.1
-
4
-
-
0000890471
-
Thermal residual stresses in ceramic-to-metal brazed joints
-
Levy, A. 1991. Thermal residual stresses in ceramic-to-metal brazed joints. Journal American Ceramics Society 74(9): 2141-2147.
-
(1991)
Journal American Ceramics Society
, vol.74
, Issue.9
, pp. 2141-2147
-
-
Levy, A.1
-
5
-
-
0345531255
-
-
note
-
Kovar™ is a registered trademark of Carpenter Technologies Corp. The spacer material used in these assemblies was designated as ASTM F186 and is often referred to as "clean" Kovar™.
-
-
-
-
6
-
-
38349058884
-
Joining oxide ceramics
-
Materials Park, Ohio.: ASM International
-
Moorhead, A., and Hyour, K. 1992. Joining oxide ceramics. Eng. Mater. Handbook, Vol. 4, Ceramics and Glasses. pp. 511-522. Materials Park, Ohio.: ASM International.
-
(1992)
Eng. Mater. Handbook, Vol. 4, Ceramics and Glasses
, pp. 511-522
-
-
Moorhead, A.1
Hyour, K.2
-
7
-
-
0344668975
-
-
note
-
Cusil ABA™ is a registered trademark of Wesgo Industries
-
-
-
-
9
-
-
0345099771
-
-
note
-
Inconel is a registered trademark of INCO, International.
-
-
-
-
10
-
-
0141914141
-
Reaction layer formation on the metal side of active brazed, metal-ceramic joints
-
Wielage, B., Podlesak, H., and Klose, H. 1997. Reaction layer formation on the metal side of active brazed, metal-ceramic joints. Proc. Joining 97 Conference, Jena, Germany.
-
(1997)
Proc. Joining 97 Conference, Jena, Germany
-
-
Wielage, B.1
Podlesak, H.2
Klose, H.3
-
11
-
-
0345099772
-
-
note
-
3 produced by Wesgo Industries.
-
-
-
-
12
-
-
0009350467
-
The role of interfacial reactions on the mechanical properties of ceramic brazements
-
eds. J. Pask and A. Evans; New York, N.Y.: Plenum Press
-
Moorhead, A., et al. 1988. The role of interfacial reactions on the mechanical properties of ceramic brazements. Ceramic Microstructures '86, eds. J. Pask and A. Evans, pp. 949-958. New York, N.Y.: Plenum Press.
-
(1988)
Ceramic Microstructures '86
, pp. 949-958
-
-
Moorhead, A.1
-
13
-
-
0028404010
-
Interfacial reaction between alumina and Cu-Ti filler metal during reactive metal brazing
-
Bang, K., and Liu, S. 1994. Interfacial reaction between alumina and Cu-Ti filler metal during reactive metal brazing, Welding Journal 73(3):54-s to 60-s.
-
(1994)
Welding Journal
, vol.73
, Issue.3
-
-
Bang, K.1
Liu, S.2
-
14
-
-
0003689862
-
-
Ed. T. Massalski; Materials Park, Ohio: ASM International
-
Binary Alloy Phase Diagrams. 1986. Ed. T. Massalski, pp. 25, 915. Materials Park, Ohio: ASM International.
-
(1986)
Binary Alloy Phase Diagrams
-
-
-
16
-
-
0025065572
-
Metastable nickel-tin intermetallic compound in tin-based coatings
-
Association of Electroplaters and Surface Finishers
-
Haimovich, J., and Kahn, D. 1990. Metastable nickel-tin intermetallic compound in tin-based coatings. Proceedings of the 77th AESF Annual Technical Conference pp. 689-712, Association of Electroplaters and Surface Finishers.
-
(1990)
Proceedings of the 77th AESF Annual Technical Conference
, pp. 689-712
-
-
Haimovich, J.1
Kahn, D.2
-
17
-
-
0029386217
-
Intermetallic compound layer growth by solid-state reactions between 58Bi-42Sn solder and copper
-
Vianco, P., Kilgo, A., and Grant, R. 1995. Intermetallic compound layer growth by solid-state reactions between 58Bi-42Sn solder and copper. Journal of Electronic Materials 24: 1493-1505.
-
(1995)
Journal of Electronic Materials
, vol.24
, pp. 1493-1505
-
-
Vianco, P.1
Kilgo, A.2
Grant, R.3
-
18
-
-
0029393483
-
Solid-state intermetallic compound layer growth between copper and hot dipped indium coatings
-
Vianco, P., Kilgo, A., and Grant, R. 1995. Solid-state intermetallic compound layer growth between copper and hot dipped indium coatings. Journal of Materials Science 30: 4871-4878.
-
(1995)
Journal of Materials Science
, vol.30
, pp. 4871-4878
-
-
Vianco, P.1
Kilgo, A.2
Grant, R.3
-
19
-
-
0016575952
-
The wetting and bonding of diamonds by copper-base binary alloys
-
Scott, P., et al. 1975. The wetting and bonding of diamonds by copper-base binary alloys. Journal of Materials Science 10: 1833-1840.
-
(1975)
Journal of Materials Science
, vol.10
, pp. 1833-1840
-
-
Scott, P.1
-
20
-
-
0001279642
-
-
Ed. T. Massalski; Materials Park, Ohio: ASM International
-
Binary Alloy Phase Diagrams. 1986. Ed. T. Massalski, p. 809. Materials Park, Ohio: ASM International.
-
(1986)
Binary Alloy Phase Diagrams
, pp. 809
-
-
-
22
-
-
0010762724
-
-
Ed. T. Massalski; Materials Park, Ohio: ASM International
-
Binary Alloy Phase Diagrams. 1986. Ed. T. Massalski, p. 1768. Materials Park, Ohio: ASM International.
-
(1986)
Binary Alloy Phase Diagrams
, pp. 1768
-
-
|