Multilayer ceramics: a revitalization

Electronic Packaging and Production

Volumn 36, Issue 10, 1996, Pages

  Sigliano, Richard E ^a   Lanzone, Robert ^a  

^a Kyocera America Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CERAMIC MATERIALS; FLIP CHIP DEVICES; MULTILAYERS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRODUCT DESIGN; RELIABILITY;

CERAMIC PIN GRID ARRAYS; DIRECT CHIP ATTACH; FLIP CHIP PACKAGING; MULTILAYER CERAMICS;

ELECTRONICS PACKAGING;

EID: 0030230854     PISSN: 00134945     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)