Microstructural modeling and electronic interconnect reliability

International Journal of Microcircuits and Electronic Packaging

Volumn 20, Issue 2, 1997, Pages 124-129

  Winter, P R ^a   Wallach, E R ^b  

^a NORTEL NETWORKS   (Canada)

^b UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

Fatigue; Finite Element; Life Prediction; Reliability; Solder Joints; Thermal Cycling

Indexed keywords

EID: 0344627232     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (17)

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