Adhesive properties of silicone polymers on some typical opto-electronic substrates: Influence of the network density

International Journal of Adhesion and Adhesives

Volumn 24, Issue 1, 2004, Pages 55-68

  Robert, C ^a,c   Crespy, A ^b   Bastide, S ^a   Lopez Cuesta, J M ^a   Kerboeuf, S ^c   Artigue, C ^c   Grard, E ^c  

^a ECOLE DES MINES D ALÈS   (France)

^b UNIVERSITÉ DE TOULON   (France)

^c NOKIA RESEARCH CENTER   (United States)

Author keywords

A. Silicones; C. Finite element stress analysis; C. Rheology; D. Mechanical properties of adhesives

Indexed keywords

COMPOSITION; CROSSLINKING; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MICROSTRUCTURE; OPTOELECTRONIC DEVICES; RHEOLOGY; SILICONES; STRESS ANALYSIS; VISCOSITY;

ADHESIVE PROPERTIES; SILICON POLYMERS;

ADHESIVES;

EID: 0344062617     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-7496(03)00100-3     Document Type: Article

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