Cu contamination control for advanced interconnect manufacturing

Solid State Technology

Volumn 43, Issue 5, 2000, Pages 137-138,-140,-142,-145

  Dornisch, Dieter ^a   Li, Guangming ^a   Brongo, Maureen ^a  

^a Conexant Systems Inc ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CONTAMINATION; COPPER; METAL CLEANING; METALLIZING; MICROELECTRONICS;

CONTAMINATION CONTROL; INTERCONNECT MANUFACTURE;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0343777281     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (9)

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