Chemical shrinkage and diffusion-controlled reaction of an epoxy molding compound

European Polymer Journal

Volumn 36, Issue 10, 2000, Pages 2213-2219

  Tai, Horng Jer ^a   Chou, Hui Lung ^a  

^a I SHOU UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DIFFERENTIAL SCANNING CALORIMETRY; DIFFUSION IN SOLIDS; GLASS TRANSITION; MATHEMATICAL MODELS; NUMERICAL METHODS; REACTION KINETICS; SHRINKAGE; STRESS ANALYSIS; TEMPERATURE; THERMAL EXPANSION;

CHEMICAL SHRINKAGE; CURE KINETICS; DIFFUSION CONTROL; EPOXY MOLDING COMPOUND; LINEAR COEFFICIENT OF THERMAL EXPANSION;

EPOXY RESINS;

EID: 0343714833     PISSN: 00143057     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0014-3057(99)00278-5     Document Type: Article

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