Temperature and stress time history responses in electronic packaging

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 1, 1996, Pages 248-254

  Lau, John H ^a,b  

^a IEEE

^b Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY VALUE PROBLEMS; ELASTIC MODULI; FINITE ELEMENT METHOD; FREQUENCIES; HEAT CONDUCTION; SHEAR STRESS; SPECIFIC HEAT; TEMPERATURE; THERMAL CONDUCTIVITY; THERMAL STRESS; THERMOELASTICITY;

CLOSED FORM SOLUTIONS; GOVERNING EQUATIONS; HEAT SOURCES; TIME HISTORY RESPONSES;

ELECTRONICS PACKAGING;

EID: 0030087061     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.486509     Document Type: Review

References (13)

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