Solvent-free plasma removal of etch polymers

Solid State Technology

Volumn 42, Issue 3, 1999, Pages

  Christaud, Jean Francois ^a,c   Helle, Wolfgang ^b   Ranft, Craig ^b   Gapasin, Cynthia ^b  

^a STMICROELECTRONICS   (France)

^b MATTSON THERMAL PRODUCTS GMBH   (United States)

^c Ecole Nationale Superieure de Chimie et de Physique de Bordeaux   (France)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0343266082     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (4)

1. H. Shan et al., "Effects of Deposition and Ion Scattering on Profile Control in Submicron Etch," J Electrochem. Soc., Vol. 141, p. 2904, 1994.
2. S. Marks et al., in Cleaning Technology in Semiconductor Device Manufacturing IV, ed. R.E. Novak, J. Ruzyllo, PV 95-20, p. 214, The Electrochemical Society Proceedings Series, Pennington, NJ, 1995.
3. D.L. Flamm, "Dry Plasma Resist Stripping Part II: Physical Processes," Solid State Technology, Vol. 35, No. 9, pp. 43-48, 1992.
4. S. Savas, "Advanced Photoresist Strip with a High-pressure ICP Source," Solid State Technology, Vol. 39, No. 10, pp. 123-128, 1996.