Dynamic pulsed plasma reactor for chemical vapor deposition of advanced materials

Review of Scientific Instruments

Volumn 68, Issue 3, 1997, Pages 1575-1581

  Sanner, Mark A ^a   Park, Jin Y ^a  

^a UNIVERSITY OF IDAHO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0343183166     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1147928     Document Type: Article

References (31)

1. L. E. Brus et al., J. Mater. Res. 4, 705 (1989).
2. H. E Schaefer, R. Wurschum, R. Birringer, and H. Gleiter, J. Less-Common Met. 140, 161 (1988).
3. R. Birringer, H. Gleiter, H. P. Klein, and P. Marquardt, Phys. Lett. A 102, 365 (1984).
4. R. Dagani, C&EN March, 20 (1993).
5. R. W. Siegel and J. A. Eastman, Mater. Res. Soc. Symp. Proc. 132, 3 (1989).
6. F. H. Froes, C. Suryanarayana, G. Chen, A. Frefer, and G. R. Hyde, JOM May, 26 (1992).
7. R. W. Smith, D. Wei, and D. Apelian, Plasma Chem. Plasma Process. 9, 135S (1989).
8. G. Soucy, J. W. Jurewicz, and M. I. Boulos, Plasma Chem. Plasma Process. 14, 43 (1994).
9. R. F. Bunshah, IEEE Trans. Plasma Sci. 18, 846 (1990).
10. J. C. Parker, R. W. Brotzman, and M. N. Ali, Mater. Manufact. Process. 11, 263 (1996).
11. K. Etemadi, Plasma Chem. Plasma Process. 11, 41 (1991).
12. T. Ono, M. Kagawa, Y. Syono, M. Ikebe, and Y. Muto, Plasma Chem. Plasma Process. 7, 201 (1987).
13. M. Kobayashi, T. Honda, and A. Kanzawa, Plasma Chem. Plasma Process. 5, 39 (1985).
14. P. Proulx and J. Bilodeau, Plasma Chem. Plasma Process. 11, 371 (1991).
15. B. M. Smirnov and N. P. Tishchenko, Plasma Chem. Plasma Process. 11, 561 (1991).
16. S. V. Joshi, Q. Liang, J. Y. Park, and J. A. Batdorf, Plasma Chem. Plasma Process. 10, 339 (1990).
17. P. Kong, T. Huang, and E. Pfender, IEEE Trans. Plasma Sci. 14, 357 (1986).
18. H. Sekiguchi, A. Kanzawa, and T. Honda, Plasma Chem. Plasma Process. 9, 257 (1989).
19. R. A. LaViolette, R. A. Berry, and R. McGraw, Plasma Chem. Plasma Process. 16, 249 (1996).
20. N. Rao, S. Girshick, J. Heberlein, P. McMurry, S. Jones, D. Hansen, and B. Micheel, Plasma Chem. Plasma Process. 15, 581 (1995).
21. J. S. McFeaters, R. L. Stephens, P. Schwerdtfeger, and M. Liddell, Plasma Chem. Plasma Process. 14, 333 (1994).
22. S. L. Girshick and C. P. Chiu, Plasma Chem. Plasma Process. 9, 355 (1989).
23. S. G. Hutchison, C. M. Wai, J. Dong, and R. J. Kearney, Plasma Chem. Plasma Process. 15, 353 (1995).
24. R. C. Miller and R. J. Ayen, I & EC Process Design Develop. 8, 370 (1969).
25. M. A. Sanner and J. Y. Park, Rev. Sci. Instrum. 67, 3675 (1996).
26. D. R. Stull, Handbook of Chemistry and Physics, 63rd ed., edited by R. C. Weast (Chemical Rubber, Boca Raton, FL, 1982), p. D-202.
27. A. G. Gaydon and I. R. Hurle, The Shock Tube in High Temperature Chemical Physics (Reinhold, New York, 1963).
28. S. Lin and G. P. Theofilos, Phys. Fluids 6, 1369 (1963).
29. E. L. Resler, S. C. Lin, and A. Kantrowitz, J. Appl. Phys. 23, 1390 (1952).
30. A. N. Nesmeyanov, Vapor Pressure of the Elements, edited by J. J. Carasso (Academic, New York, 1963), p. 445.
31. O. Knacke, O. Kubaschewski, and K. Hesselmann, Thermochemical Properties of Inorganic Substances (Springer, Berlin, 1991), p. 2103.