Strain effects in multi-layers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3223, Issue , 1997, Pages 149-159

  Ashruf, C M A ^a,b   French, P J ^a,b   De Boer, C ^a,c   Sarro, P M ^a,c  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b Electronic Instrumentation Laboratory   (Netherlands)

^c Lab of Electronic Materials Devices and Components

Author keywords

LPCVD poly silicon; LPCVD silicon nitride; Strain; Stress; Surface micromachining

Indexed keywords

COMPOSITE MICROMECHANICS; MACHINING; MECHANICAL PROPERTIES; MICROANALYSIS; MICROFABRICATION; MICROMACHINING; NITRIDES; NONMETALS; POLYSILICON;

DEPOSITED LAYERS; DOMINANT FACTORS; HIGH STRESSES; LPCVD POLY-SILICON; LPCVD SILICON-NITRIDE; MULTI-LAYERS; MULTILAYERED STRUCTURES; POLY LAYERS; STRAIN EFFECTS; UNDERLYING LAYERS;

STRESSES;

EID: 0343085745     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284475     Document Type: Conference Paper

References (10)

1. A.P. Friedrich, P.A. Besse, C.M.A. Ashruf, R.S. Popovic, "New piezo-tunneling strain sensor with very low temperature sensitivity", Proceedings Transducers 97, pp. 133-136, Chicago, June 1997.
2. J.J. Wortman, J.R. Hauser, R.M. Burger, "Effect of mechanical stress on p-n junction device characteristics", Journal of Applied Physics, Vol. 35, pp. 2122-2131, 1964.
3. O. Tabata, K. Kawahata, S. Sugiyama, I. Igarashi, "Mechanical property measurements of thin films using load-deflection of composite rectangular membranes", Sensors and Actuators, vol. 20, pp. 135-141, 1989.
4. P.J. French, C. de Boer, P.M. Sarro, "Strain measurements in multi-layers", Proceedings of the seventh conference on Sensors and their Applications, pp. 112-116, Dublin (Ireland), September 1995.
5. P.J. French, P.M. Sarro, R. Mallée, E.J.M. Fakkeldij, R.F. Wolffenbuttel, "Optimization of a low-stress silicon nitride process for surface-micromachining applications", to be published in Sensors and Actuators.
6. P.J. French, B.P. van Drieënhuizen, D. Poenar, J.F.L. Goosen, R. Mallée, P.M. Sarro, R.F. Wolffenbuttel, "The development of a low-stress polysilicon process compatible with standard device processing", Journal of Microelectromechanical Systems, vol. 5, no. 3, pp. 187-196, 1996.
7. B.P. van Drieënhuizen, J.F.L. Goosen, P.J. French, R.F. Wolffenbuttel, "Comparison of techniques for measuring both compressive and tensile stress in thin films", Sensors and Actuators, vol. 37-38, p. 756-765, 1993.
8. P.A. Flinn, D. S. Gardner, W. D. Nix, "Measurement and interpretation of stress in aluminum-based metallization as a function of thermal history", IEEE Transactions on Electron Devices, vol. 34, no. 3, pp. 689-698, 1987.
9. D. Poenar, P.J. French, R. Malleé, P.M. Sarro, R.F. Wolffenbuttel, "PSG layers for surface micromachining", Sensors and Actuators, vol. 41-42, pp. 304-309, 1994
10. D. Maier-Schneider, A. Köprülülü, S. Ballhausen Holm, E. Obermeier, "Elastic properties and microstructure of LPCVD polysilicon films", Journal of Micromechanics and Microengineering, vol. 6, pp. 436-446, 1996.