Micro heat exchangers consisting of pin arrays

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 1, 1997, Pages 51-57

  Yin, Xiaoqing ^a   Bau, H H ^a  

^a UNIVERSITY OF PENNSYLVANIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLANTS; CRYOGENIC LIQUIDS; HEAT RESISTANCE; HEAT SINKS; MULTICHIP MODULES; NITROGEN; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; THREE DIMENSIONAL COMPUTER GRAPHICS;

MICROHEAT EXCHANGERS; PIN ARRAYS;

ELECTRONICS PACKAGING;

EID: 0031098953     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792200     Document Type: Article

References (24)

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