Verification of a governing parameter for electromigration damage in bamboo lines

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Sasagawa, Kazuhiko ^a   Naito, Kazushi ^a   Hasegawa, Masataka ^a   Saka, Masumi ^a   Abé, Hiroyuki ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; CURRENT DENSITY; ELECTROMIGRATION; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; TEMPERATURE DISTRIBUTION;

ATOMIC FLUXES; BAMBOO LINES;

ELECTRONICS PACKAGING;

EID: 0342298372     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Huntington, H. B. and Grone, A. R., 1961, "Current-Induced Marker Motion in Gold Wires," Journal of Physics and Chemistry of Solids, Vol. 20, Nos. 1/2, pp. 76-87.
2. Kirchheim, R. and Kaeber, U., 1991, "Atomistic and Computer Modeling of Metallization Failure of Integrated Circuits by Electromigration," Journal of Applied Physics, Vol. 70, No. 1, pp. 172-181.
3. Kuo, B. S. W., Li, J. C. M. and Schmid, A. W., 1992, "Thermal Conductivity and Interface Thermal Resistance of Si Film on Si Substrate Determined by Photothermal Displacement Interferometry" Applied Physics, A55, pp. 289-296.
4. Sasagawa, K., Saka, M. and Abé, H., 1995, "Current Density and Temperature Distributions Near the Corner of Angled Metal Line," Mechanics Research Communications., Vol.22, No5, pp. 473-483.
5. Sasagawa, K., Nakamura, N., Saka, M. and Abé, H., 1998a," A New Approach to Calculate Atomic Flux Divergence by Electromigration," ASME Journal of Electronic Packaging, Vol.120, No.4, pp. 360-366.
6. Sasagawa, K., Nakamura, N., Saka, M. and Abé, H., 1998b, "Experimental Verification of Dominating Parameter of Electromigration Damage in Metal Lines of Electronic Packages," Transactions of the Japan Society of Mechanical Engineers, in Japanese, in press.
7. Sasagawa, K., Naito, K., Saka, M. and Abé, H., 1998c, "Verification of Dominant Parameter of Electromigration Damage for Bamboo Lines," Preprint of the Japan Society of Mechanical Engineers, No.98-2, pp.343-344, in Japanese.